$42.00

BGA Reballing platform EMMC/EMCP/UFS BGA153/162/169/186/221/254 Martview RB-01
[Martview RB-01 Reballing Stencil Tin Net Full Set]

BGA Reballing platform EMMC/EMCP/UFS BGA153/162/169/186/221/254 Martview RB-01
Martview RB-01 Reballing Stencil Tin Net Full Set for EMMC/EMCP/UFS BGA153/162/169/186/221/254 With Fixed Plate and Holder















Martview RB-01 Reballing Stencil Full Set
Features:
Black reballing stencil net design, black and white contrast The black meshes are in sharp contrast with the white solder joints of the chip, which makes it possible to see the alignment more clearly
The black stencil net has good light absorption properties, which can effectively reduce visual fatigue, will bring you a different feeling of planting tin
High-temperature resistance and abrasion resistance Imported alloy steel, metal fatigue resistance, make the product use more durable
Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints
The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
High precision, no burrs, so that every mesh can be of the same size and not stuck
Double magnet, super magnetic, accurate positioning without shaking
With fixing plate and holder
Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254
Stencil net thickness: 0.15mm
Holder size: 80*80*15mm
Packing size: 89*89*32mm
Package includes:
6 x Stencil net
2 x Adjustment frame
2 x Adjustment piece
1 x Tin scraper
1 x Fixed plate

1 x Holder
1 x Packing box
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