What is ACF Tape | Film (Anisotropic Conductive Film)
ACF Tape | Film is a conductive adhesive tape used by electronics industry to make electrical or mechanical connections from drive electronics to substrates. ACF is widley used to make interconnect between IC or Flexible circuits on to substrates like glass, PCBs & FPCs.
ACF offers several advantages including fine pitch capability, economical, low temperature and fast simple processes. It is also lead-free and fluxless thus eliminating post-assembly cleaning.

How does ACF works
First the ACF is attached or laminated on to a base substrate.
Then the device or secondary substrate is aligned over the base material and pressed together. This mounting process usually involve minimal heat and pressure to make the ACF tacky.
During ACF final bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductive particles (each 3~30um) are compressed between IC and substrate (glass/ PCB) while insulating materials pushed away.
This allows compressed Ni-Au layer on the particles to conduct electricity between IC and substrates.

Applications of ACF Tape
ACF has been for decades used in glass display applications. Now, it is also widely used in COF and COB areas.
Examples of ACF applications :
TAB bonding (TCP-PCB/ TCP-LCD)
FOB bonding (Flex-PCB)
COG bonding (IC-LCD)
COB bonding (IC-PCB)
COF bonding (IC-FPC)
FCOF bonding (Flip-chip on Flex)
Plasma Display (FPC-PDP)
Camera Module